The N2P variant is designed for mobile devices and mid-range PC chips, while the N2X variant is optimized for high-performance central processing units (CPUs) by enabling operation at higher voltages. Node A16 will introduce a Back End Power Distribution Network (BSPDN), which aims to improve performance while addressing the challenge of increased heat production. Therefore, A16-based chips are specifically designed for artificial intelligence (AI) accelerators in data centers. With this roadmap, TSMC continues to lead the semiconductor industry, serving the needs of diverse markets, from mobile devices to high-performance AI applications, while focusing on advancements in efficiency and semiconductor capabilities.